SYSTEM Cited by 1 source

ORv3 (Open Rack v3 HPR)

ORv3 is the third-generation Open Rack specification from the Open Compute Project (OCP). The HPR (High-Power Rack) variant introduced by Meta's Catalina at OCP Summit 2024 supports up to 140 kW per rack — a capacity necessary to host NVIDIA Blackwell-class AI compute trays at rack scale.

Seen in

• sources/2024-10-15-meta-metas-open-ai-hardware-vision — Meta introduces ORv3 HPR as the physical chassis underlying Catalina; "With Catalina we're introducing the ORv3, a high-power rack (HPR) capable of supporting up to 140kW."

Why it matters

• Rack-level power envelope > 100 kW as a stock OCP shape. Prior Open Rack versions were aligned with the ~ 25-40 kW envelope that is routine in dense-but-air-cooled data halls. ORv3 HPR is a different regime requiring liquid cooling and redesigned power distribution.
• Upstream dependency for Catalina, FBNIC, DSF. ORv3 is the rack-chassis primitive that Meta's Blackwell-based AI stack plugs into; the 140 kW envelope makes GB200-tray density feasible.

Related

• systems/catalina-rack — the Meta-specific AI-rack design built on ORv3 HPR.
• concepts/rack-level-power-density — the binding constraint ORv3 HPR lifts by an order of magnitude.
• concepts/liquid-cooled-ai-rack — cooling architecture required at ORv3 HPR's power envelope.
• systems/mount-diablo-power-rack — the Meta × Microsoft 400 VDC power-rack companion contribution.
• companies/meta.